EP2AGZ350HF40I3G vs EP2AGZ350HF40C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40I3G sa pamamagitan ng Altera at EP2AGZ350HF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40I3G | EP2AGZ350HF40C3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 LE | 348,500 |
| Adaptive Logic Modules (ALMs) | 139,400 ALM | [DATA_NEEDED: ALM count] |
| Embedded Memory | 20.29 Mbit | — |
| Embedded Multipliers (18x18) | 1,170 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-ball FCBGA (HF40) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Speed Grade | -3 | — |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Tindminan RoHS | Compliant (Pb-free) | — |
| Lead-Free Finish | Yes (G suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Process Technology | 40nm TSMC | 40 nm low-power |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | Up to 24 (per family datasheet) |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |