EP2C5F256C8N vs EP2C5AF256I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C5F256C8N sa pamamagitan ng Intel at EP2C5AF256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C5F256C8N - Cyclone II FPGA, 4.6K LEs, 158 I/O | Altera / Intel
EP2C5F256C8N ⚠ Huling PagbiliIntel
EP2C5AF256I8N - 4,608 LEs Cyclone II FPGA, 158 I/O, 256-FBGA | Intel
EP2C5AF256I8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2C5F256C8N | EP2C5AF256I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 4,608 | — |
| Logic Array Blocks (LAB) | 288 | — |
| Embedded Memory (M4K blocks) | 119,808 bits (~14.6 Kbytes) | — |
| Embedded 18x18 Multipliers | 13 | — |
| PLLs | 2 | 4 |
| Maximum User I/O Pins | 158 | — |
| Process Technology | 90 nm low-k CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 8 (commercial) | 8 |
| Packhaging | 256-ball FineLine BGA (FBGA-256) | 256-LBGA (FBGA), 17 mm body |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 °C to +85 °C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), Passive Serial | — |
| Level ng MSL | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant (lead-free, 'N' suffix) |
| Logic Elements | — | 4,608 |
| Total RAM Bits | — | 119,808 |
| Number of I/O Pins | — | 158 |
| Number of Logic Units / LABs | — | [DATA_NEEDED: number of LABs] |
| Embedded Multipliers (18x18) | — | 13 |
| Maximum Toggle Frequency | — | 402.5 MHz |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| DSP Performance | — | Up to approximately 25 GMACS |