EP2C5F256I8N vs EP2C5F256C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C5F256I8N sa pamamagitan ng Intel at EP2C5F256C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C5F256C8N - Cyclone II FPGA, 4.6K LEs, 158 I/O | Altera / Intel
EP2C5F256C8N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2C5F256I8N | EP2C5F256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 4,608 | — |
| Embedded Memory | 119,808 bits (M4K blocks) | — |
| Number of M4K RAM Blocks | 26 | — |
| Embedded 18x18 Multipliers | 13 | 13 |
| PLLs | 2 | 2 |
| Maximum User I/O | 158 | — |
| Number of I/O Banks | 8 | — |
| Supply Voltage (Core) | 1.15 V to 1.25 V (1.2 V typ.) | — |
| Hanay ng Temperature na Operasyon | -40 C to +85 C (industrial, 'I' grade) | — |
| Packhaging | 256-ball FineLine BGA (FBGA-256), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA-256) |
| JEDEC Package Code | S-PBGA-B256 | — |
| Process Node | 90 nm | — |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead-Free | Yes | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Family | — | Cyclone II |
| Logic Elements (LE) | — | 4,608 |
| Logic Array Blocks (LAB) | — | 288 |
| Embedded Memory (M4K blocks) | — | 119,808 bits (~14.6 Kbytes) |
| Maximum User I/O Pins | — | 158 |
| Process Technology | — | 90 nm low-k CMOS |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | 8 (commercial) |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1), Passive Serial |
| Level ng MSL | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |