EP2C70F672C7N vs EP2C70F672C8KK Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C70F672C7N sa pamamagitan ng Intel at EP2C70F672C8KK sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C70F672C7N | EP2C70F672C8KK |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | 68,416 |
| Total Memory Bits | 1,152,000 | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 422 |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Packhaging | 672-BGA (FBGA-672) | 672-pin FBGA |
| Process Technology | 90 nm CMOS | 90 nm |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 (slower, lower-power variant) | 8 (C8) |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | Active Serial (AS), Passive Serial (PS), JTAG |
| Embedded Memory (Bits) | — | 1,152,000 (4,225 Kbits) |
| Embedded 18x18 Multipliers | — | 150 |
| Global Clock Networks | — | 16 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 402.58 MHz |