EP2S130F1020C3N vs EP2S130F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020C3N sa pamamagitan ng Intel at EP2S130F1020I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2S130F1020C3N - Stratix II FPGA, 132K LE, 742 I/O, 1020-FBGA | Intel
EP2S130F1020C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2S130F1020C3N | EP2S130F1020I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix II | — |
| Logic Elements | 132,540 LE | 132,540 |
| Number of I/O | 742 | — |
| Package Type | 1020-FBGA (33x33 mm) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Embedded Memory | [DATA_NEEDED: exact TriMatrix memory size in Mbits] | — |
| Embedded Multipliers | 504 (18x18) | — |
| PLL Count | 12 (4 enhanced + 8 fast) | — |
| Transceivers | [DATA_NEEDED: high-speed transceiver count for this speed grade] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Lead Free Status | Lead Free | — |
| Tindminan RoHS | RoHS Compliant | Compliant (per distributor listings) |
| Family | — | Stratix II |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Packhaging | — | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |