EP2S130F1020I4 vs EP2S130F1020C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020I4 sa pamamagitan ng Intel at EP2S130F1020C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1020I4 | EP2S130F1020C5 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | — |
| Equivalent LEs | ~180,000 | — |
| Adaptive Logic Modules (ALMs) | 53,016 | — |
| Embedded Memory (bits) | 6,747,840 | 6,747,840 |
| Embedded Memory (M512 blocks) | 530 | — |
| Embedded Memory (M4K blocks) | 768 | — |
| Embedded Memory (M-RAM blocks) | 4 | — |
| Embedded 18x18 Multipliers | 504 | — |
| DSP Blocks | 48 | — |
| User I/O Pins | 742 | 742 |
| User I/O Banks | 12 | — |
| Packhaging | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA |
| Process Node | 90 nm CMOS, all-layer copper | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | I (industrial performance) | 5 |
| Device Revision | 4 | — |
| Temperature ng Junction na Operasyon | -40C to +100C (industrial) | — |
| Configuration Scheme | Fast Passive Parallel x8, Passive Serial, JTAG | — |
| Uri ng Pagpapasok | Surface Mount (FC-FBGA) | Surface Mount |
| Tindminan RoHS | Compliant (per distributor listings) | [DATA_NEEDED: rohs status] |
| Logic Elements (LE) | — | 132,540 |
| Operating Frequency (max) | — | 609.76 MHz |
| Process Technology | — | 90 nm CMOS, all-layer copper |
| Core Voltage | — | 1.2 V |
| Number of Multipliers (18x18) | — | 252 |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |