EP2S130F1508C3 vs EP2S130F1508C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508C3 sa pamamagitan ng Intel at EP2S130F1508C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1508C3 | EP2S130F1508C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 6,747,840 | — |
| Maximum User I/O | 1,126 | — |
| Process Technology | 90 nm | — |
| Core Voltage (typical) | 1.2 V | — |
| Speed Grade | C3 (commercial) | -5 (C5) |
| Packhaging | 1508-ball FC-BGA | 1508-ball FC-FBGA |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | [DATA_NEEDED: transceiver count/grade] | Up to 12 channels (family maximum) |
| PLLs (Fast + Enhanced) | 8 + 4 (per family) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: per lot] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LE) | — | 132,600 |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/Os | — | 1,126 |
| Package Pin Count | — | 1508 |
| Operating Voltage (Core) | — | 1.2 V |
| Process Node | — | 90 nm |
| Temperature Grade | — | Commercial (0C to +85C) |
| On-chip RAM | — | [DATA_NEEDED: TriMatrix RAM bits] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Transceiver Data Rate (max) | — | Up to 6.375 Gbps (family spec) |