EP2S60F1020C3 vs EP2S60F1020C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S60F1020C3 sa pamamagitan ng Altera at EP2S60F1020C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S60F1020C3 | EP2S60F1020C3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Stratix II | — |
| Family | Stratix II FPGA | Stratix II |
| Logic Elements (LEs) | 60,440 | — |
| Logic Array Blocks (LABs) | 3022 | 3,022 |
| Total RAM Bits | 2,544,192 bits (2.5 Mbit) | — |
| User I/O Count | 718 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| DSP Blocks (18x18 multipliers) | 144 18x18 multipliers (36 DSP blocks) | — |
| PLLs | 12 | 12 |
| Global Clock Networks | 18 | — |
| Maximum Internal Frequency | 816.99 MHz | 717 MHz |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm |
| Temperature na Operasyon | 0C to +85C (commercial, C3 speed grade) | 0C to +85C (commercial) |
| Packhaging | 1020-ball FC-FBGA | 1020-ball FC-FBGA |
| Package Body Size | 33 mm x 33 mm, 1.0 mm ball pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supplier Device Package | 1020-BGA | — |
| Speed Grade | C3 | C3 (slowest commercial) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Embedded Multipliers (18x18) | — | 36 |
| Maximum User I/Os | — | 718 |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |