EP2SGX130GF40C4NGB vs EP2SGX130GF40C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX130GF40C4NGB sa pamamagitan ng Intel at EP2SGX130GF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
EP2SGX130GF40C4NGB ObsoletePagsanggunian na paghahambing
| Parametro | EP2SGX130GF40C4NGB | EP2SGX130GF40C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix II GX | — |
| Family | Enhanced Configuration (EPC) Devices | Stratix II GX |
| Logic Elements | 132,540 | 132,540 |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/O Pins | 734 | — |
| Packhaging | 1508-ball FBGA (GF40) | 1508-ball FC-FBGA |
| Terminal Pitch | 1.00 mm | — |
| Speed Grade | C4 | C3 |
| Temperature Grade | Commercial (0C to 85C) | — |
| Transceivers | Up to 20 multi-gigabit transceivers | — |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps |
| PLLs | 8 | — |
| On-chip Memory | TriMatrix memory (block RAM + distributed RAM) | — |
| DSP Blocks | Yes (embedded multipliers) | — |
| Configuration | Enhanced / EPC mode | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded Memory | — | 6.7 Mbits |
| Embedded Multipliers (18x18) | — | 252 |
| User I/O Count | — | 734 |
| Transceiver Count | — | 40 channels |
| Process Technology | — | 90 nm |
| Core Voltage | — | 1.2 V |
| Uri ng Pagpapasok | — | Surface Mount (flip-chip BGA) |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel / JTAG |