EP2SGX30CF780C3N vs EP2SGX30CF780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C3N sa pamamagitan ng Intel at EP2SGX30CF780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX30CF780C3N | EP2SGX30CF780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix II GX | — |
| Number of Logic Elements | 33,880 | — |
| Number of CLBs | 33,880 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Bilang ng Pins | 780 | — |
| Package Type | 780-BGA (FC-FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 °C to +85 °C (Industrial) |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family datasheet] | — |
| Embedded Memory | TriMatrix (M512/M4K/M-RAM blocks) | — |
| Total Embedded RAM | ~1.4 Mbit | — |
| DSP Blocks | 18-bit x 18-bit dedicated multipliers | — |
| Configuration Modes | PS, FPP, JTAG | — |
| Number of User I/O | [DATA_NEEDED: pin count varies by package; ~600 typical for 780-BGA] | — |
| Tindminan RoHS | [DATA_NEEDED: not stated in retrieved web snippets] | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Lead-Free | [DATA_NEEDED: not stated in retrieved web snippets] | — |
| Supply Voltage Range | [DATA_NEEDED: full VTT/VCCIO not stated in retrieved web snippets] | — |
| Family | — | Stratix II GX |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Number of User I/O Pins | — | 361 |
| Transceivers | — | Embedded multi-gigabit transceivers (6.375 Gbps) |
| Packhaging | — | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Terminal Pitch | — | 1.0 mm |
| Temperature Grade Suffix | — | I3 (Industrial) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |