EP2SGX30CF780C5N vs EP2SGX30CF780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C5N sa pamamagitan ng Intel at EP2SGX30CF780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX30CF780C5N | EP2SGX30CF780C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Manufacturer | Intel (formerly Altera) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 30,560 (33,880 logic cells) | 33,880 |
| LABs/CLBs | 1694 | — |
| Total RAM Bits | 1,369,728 bits | — |
| Number of I/Os | 361 | — |
| Core Voltage | 1.2 V | — |
| Operating Frequency (max) | 609.76 MHz | — |
| Speed Grade | C5 (-5 internal speed bin) | -3 |
| Process Technology | 90 nm CMOS | — |
| Packhaging | FBGA-780 (29 x 29 mm, 1.0 mm pitch) | 780-ball FineLine BGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead-Free | Yes (per datasheet) | Yes |
| JEDEC Package Outline | MS-034AAM-1 | — |
| Tindminan RoHS | Compliant (per Intel product page) | Compliant |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Wala sa Halogen | — | [DATA_NEEDED: halogen-free status] |