EP2SGX30CF780C6 vs EP2SGX30CF780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C6 sa pamamagitan ng Intel at EP2SGX30CF780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX30CF780C6 | EP2SGX30CF780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Packhaging | 780-ball FineLine BGA (F780) | 780-ball FC-FBGA |
| Speed Grade | C6 (commercial, mid-speed) | C4 (mid-speed, commercial) |
| Temperature na Operasyon | 0C to +85C (commercial) | Commercial (0C to +85C) - inferred from C grade |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (Pb-free, 'N' suffix) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 33,880 |
| Logic Array Blocks (LABs) | — | 1,694 |
| Total RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Operating Frequency (max) | — | 732.1 MHz |
| Package Pin Count | — | 780 |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Method | — | Serial / JTAG via EPC16 or EPC64 flash |
| Embedded Transceivers | — | Up to 20 multi-gigabit transceivers (600 Mbps - 6.375 Gbps) |