EP2SGX30CF780I5N vs EP2SGX30CF780C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780I5N sa pamamagitan ng Intel at EP2SGX30CF780C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30CF780I5N - 33.88K Logic Cells Stratix II GX FPGA | Intel
EP2SGX30CF780I5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX30CF780I5N | EP2SGX30CF780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Internal Frequency | 622 MHz max | — |
| Combinatorial Delay per LAB | 4.006 ns | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | 0C to +85C (commercial) |
| Packhaging | FC-FBGA-780 | 780-ball FineLine BGA (CF780) |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Terminal Form | Ball (BGA) | — |
| Logic Family | CMOS, Stratix II GX | — |
| Number of Terminals | 780 | — |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | — |
| Transceivers | Integrated multi-gigabit serial transceivers | — |
| Embedded Memory | TriMatrix memory blocks | 1.9 Mbits |
| DSP Blocks | Integrated DSP blocks | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free Fineline BGA) |
| Series | — | Stratix II GX |
| Logic Elements | — | 33,000 |
| DSP Blocks (18x18 multipliers) | — | 256 |
| Maximum User I/O | — | 361 |
| Multi-Gigabit Transceivers | — | 4 channels |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C7 (fastest commercial) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG |