EP2SGX60DF780C3N vs EP2SGX30DF780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3N sa pamamagitan ng Intel at EP2SGX30DF780C3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C3N | EP2SGX30DF780C3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Tapus ng Buhay | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | — |
| LABs/CLBs | 3,022 | — |
| Total Memory Bits | 2,544,192 | — |
| User I/Os | 364 | 361 |
| Package Type | 780-pin FC-FBGA (DF780) | FC-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Package Dimensions | 23 x 23 mm | — |
| Pitch | 1 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency | 717 MHz | 622 MHz |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range C] | -40 C to +85 C |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (per distributor listing) | Compliant |
| Logic Elements (LEs) | — | 33,880 |
| Logic Cells / Blocks | — | 33,880 |
| Embedded Memory Bits | — | 1,369,728 |
| LABs / CLBs | — | 1694 |
| Number of Pins / Balls | — | 780 |
| Logic Family | — | CMOS |