EP2SGX60DF780C4N vs EP2SGX60DF780C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C4N sa pamamagitan ng Intel at EP2SGX60DF780C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N ObsoleteIntel
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
EP2SGX60DF780C7 ObsoletePagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C4N | EP2SGX60DF780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| User I/Os | 364 | — |
| Total RAM Bits | 2,544,192 | 2,544,192 |
| Embedded Multipliers (18x18) | 144 | — |
| DSP Blocks | 36 | — |
| Transceivers | Up to 20 (up to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | — |
| Process Node | 90 nm CMOS | — |
| Packhaging | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) | 780-ball FBGA (FineLine BGA) |
| Maximum Internal Frequency | 717 MHz | — |
| Temperature na Operasyon | Commercial 0C to +85C | — |
| Speed Grade | C4 | C7 (slowest commercial) |
| Tindminan RoHS | Lead-free (per part suffix N) | [DATA_NEEDED: RoHS status] |
| User I/O Pins | — | 364 |
| Process Technology | — | 90 nm |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Junction Temperature (Commercial) | — | 0 C to 85 C |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Design Software | — | Quartus II (legacy, EOL toolchain) |