EP2SGX60EF1152C5N vs EP2SGX60EF1152C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152C5N sa pamamagitan ng Intel at EP2SGX60EF1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Huling PagbiliIntel
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152C5N | EP2SGX60EF1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3022 | — |
| Embedded Memory Bits | 2,544,192 | — |
| User I/O Count | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Maximum Operating Frequency | 609.76 MHz | — |
| Packhaging | 1152-ball FC-FBGA | — |
| Speed Grade | -5 (mid) | C4 (commercial) |
| Temperature na Operasyon | Commercial (0C to +85C) | 0C to 85C (commercial) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Device Family | — | Stratix II GX |
| Logic Array Blocks / CLBs | — | 3022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 534 |
| Number of LABs/CLBs | — | 3022 |
| Package Type | — | 1152-BBGA, FC-FBGA |
| Package Pitch | — | 1.0 mm |
| Internal Frequency | — | 717 MHz (max) |
| Propagation Delay | — | [DATA_NEEDED: propagation delay exact value] |