EP2SGX60EF1152I3N vs EP2SGX60EF1152C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152I3N sa pamamagitan ng Intel at EP2SGX60EF1152C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152I3N | EP2SGX60EF1152C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | 2,544,192 |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| User I/O Count | — | 534 |
| Maximum Operating Frequency | — | 609.76 MHz |
| Packhaging | — | 1152-ball FC-FBGA |
| Speed Grade | — | -5 (mid) |
| Temperature na Operasyon | — | Commercial (0C to +85C) |