EP2SGX60EF1162I4N vs EP2SGX60EF1152C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1162I4N sa pamamagitan ng Altera at EP2SGX60EF1152C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60EF1162I4N | EP2SGX60EF1152C5N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory | 2,544,192 bits | — |
| DSP Blocks | 12 | — |
| 18x18 Multipliers | 252 | — |
| User I/Os | 534 | — |
| Transceivers | Up to 20 (600 Mbps to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Packhaging | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch | 1152-ball FC-FBGA |
| Speed Grade | I4 (industrial) | -5 (mid) |
| Temperature Range | -40C to +100C (junction) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Mode | Enhanced (EPC) / Fast Passive Parallel (FPP) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Process Node | 90 nm | — |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Process Technology | — | 90 nm CMOS |
| Maximum Operating Frequency | — | 609.76 MHz |
| Temperature na Operasyon | — | Commercial (0C to +85C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |