EP2SGX60FF1152 vs EP2SGX60EF1152C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60FF1152 sa pamamagitan ng Altera at EP2SGX60EF1152C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60FF1152 | EP2SGX60EF1152C5N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix II GX | — |
| Family | Stratix II GX FPGA | Stratix II GX |
| Logic Elements | 60,440 | — |
| Embedded Memory | 2,544,192 bits | — |
| DSP Blocks (18x18 Multipliers) | 192 (16 blocks) | — |
| Maximum User I/O | 364 | — |
| Number of LABs/CLBs | 3022 | — |
| Transceivers | 12 channels up to 3.125 Gbps | — |
| Packhaging | 1152-BBGA, FineLine BGA (FF1152) | 1152-ball FC-FBGA |
| Temperature na Operasyon | -40C to +85C (industrial) | Commercial (0C to +85C) |
| Voltage - Supply | 1.2 V core / multiple VCCIO rails | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Configuration Method | JTAG IEEE 1149.1, Serial, Passive Parallel, Fast Passive Parallel | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements (LE) | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3022 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| Speed Grade | — | -5 (mid) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |