EP2SGX90EF1152C3N vs EP2SGX90EF1152C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90EF1152C3N sa pamamagitan ng Intel at EP2SGX90EF1152C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
EP2SGX90EF1152C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2SGX90EF1152C3N | EP2SGX90EF1152C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Stratix II GX | Stratix II GX |
| Family | Stratix II GX | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | 558 |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | — |
| Process Technology | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Frequency (max) | 816.9 MHz | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | 5 |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Logic Array Blocks (LABs) | — | 4,548 |
| Total RAM Bits | — | 4,520,448 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Packhaging | — | 1152-ball FC-FBGA |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 12 multi-gigabit transceivers |
| Transceiver Data Rate | — | Up to 6.375 Gbps |