EP2SGX90FE1152C3 vs EP2SGX90EF1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FE1152C3 sa pamamagitan ng Intel at EP2SGX90EF1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
EP2SGX90FE1152C3 ⚠ Huling PagbiliIntel
EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
EP2SGX90EF1152C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2SGX90FE1152C3 | EP2SGX90EF1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Series | Stratix II GX | Stratix II GX |
| Family Name | Stratix II GX | — |
| Logic Elements / Cells | 90,960 | — |
| Total RAM Bits | 4,520,448 | — |
| Number of LABs / CLBs | 4,548 | — |
| Number of Logic Elements / Cells | 90,960 | — |
| Number of I/O | 558 | — |
| Number of Gates | [DATA_NEEDED: gates count] | — |
| Voltage - Supply | 1.2 V core | — |
| Temperature na Operasyon | 0C to +85C (commercial, C3 suffix) | 0C to +85C (Commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Packhaging / Kaso | 1152-BBGA / FC-FBGA | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Number of Transceiver Channels | 12 | — |
| DSP Blocks (18x18 multipliers) | 192 | — |
| Configuration Support | PS, PPS, PPA, FPP, JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | [DATA_NEEDED: MSL level] | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Core Voltage | — | 1.2 V |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Speed Grade | — | EF |
| Temperature Grade | — | C3 (Commercial) |