EP2SGX90FF1508C3 vs EP2SGX130GF1508C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C3 sa pamamagitan ng Intel at EP2SGX130GF1508C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 Obsolete
Pagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508C3 | EP2SGX130GF1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 132,540 |
| LABs / CLBs | 4,548 | — |
| Total Memory Bits | 4,520,448 | 6,748,860 |
| Maximum User I/O | 650 | 734 |
| Number of Transceivers | 4 (per family datasheet) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Speed Grade | -3 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Package Type | 1508-ball FC-FBGA (FBGA-1508) | — |
| Package Dimensions | 40 x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (Tray) | Surface Mount |
| Tindminan RoHS | Compliant | Contains lead / RoHS non-compliant |
| Configuration Method | SRAM-based, JTAG / Passive / Active serial | — |
| Logic Array Blocks (LABs) | — | 6,627 |
| Number of I/O Banks | — | 12 |
| Transceiver Channels | — | Up to 20 |
| Operating Temperature Grade | — | Commercial (C3 speed grade) |
| Packhaging | — | 1508-ball FBGA (FCBGA) 40 x 40 mm, 1.0 mm pitch |
| Maximum Internal Frequency | — | 717 MHz |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |