EP2SGX90FF1508C3 vs EP2SGX90FF1508I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C3 sa pamamagitan ng Intel at EP2SGX90FF1508I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 ObsoletePagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508C3 | EP2SGX90FF1508I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | — |
| LABs / CLBs | 4,548 | — |
| Total Memory Bits | 4,520,448 | — |
| Maximum User I/O | 650 | 650 |
| Number of Transceivers | 4 (per family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Speed Grade | -3 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Package Type | 1508-ball FC-FBGA (FBGA-1508) | — |
| Package Dimensions | 40 x 40 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Uri ng Pagpapasok | Surface Mount (Tray) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Lead-Free (compliant per datasheet) |
| Configuration Method | SRAM-based, JTAG / Passive / Active serial | JTAG, Passive Serial |
| Logic Elements (LE) | — | 90960 |
| Logic Array Blocks (LABs) | — | 4548 |
| Total Embedded Memory | — | 4520448 bits |
| Packhaging | — | 1508-BBGA, FCBGA |
| Package Body Size | — | 40 mm x 40 mm |
| Operating Temperature Grade | — | Industrial |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |