EP2SGX90FF1508C3N vs EP2SGX90FF1508C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C3N sa pamamagitan ng Intel at EP2SGX90FF1508C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
EP2SGX90FF1508C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508C3N | EP2SGX90FF1508C5 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 45,480 (approx.) | [DATA_NEEDED: ALM count] |
| LABs/CLBs | 4548 | — |
| Total RAM Bits | 4,520,448 bits | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/Os | 650 | — |
| Number of I/O Banks | 12 | — |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PLLs (Total) | 8 (4 fast + 4 enhanced) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Packhaging | 1508-ball FC-FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch | 1508-ball FC-FBGA (flip-chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | C3 | C5 |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 90,960 |
| Logic Array Blocks (LABs) | — | 4,548 |
| Embedded Memory Bits | — | 4,520,448 |
| Maximum User I/Os | — | 650 |
| Transceivers | — | Embedded multi-gigabit transceivers (MGT) |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (1.2 V nominal) |
| Maximum Internal Performance | — | 609.76 MHz |
| Configuration Method | — | Quartus II / Quartus Prime |