EP2SGX90FF1508C4 vs EP2SGX90FF1508C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C4 sa pamamagitan ng Intel at EP2SGX90FF1508C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508C4 - 90K LE Stratix II GX FPGA, 650 I/O FBGA-1508 | Intel
EP2SGX90FF1508C4 ObsoleteIntel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 ObsoletePagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508C4 | EP2SGX90FF1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Number of LABs/CLBs | 4,548 | — |
| Total RAM Bits | [DATA_NEEDED: total RAM bits] | — |
| Number of I/O | 650 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | 4 (per family datasheet) |
| Internal Clock Frequency (max) | 717 MHz | — |
| Temperature na Operasyon | 0C to 85C | 0C to +85C (commercial) |
| Package Type | FBGA-1508 (MS-034AAU-1) | 1508-ball FC-FBGA (FBGA-1508) |
| Package Dimensions | 40 mm x 40 mm | 40 x 40 mm |
| Ball Pitch | 1 mm | 1.0 mm |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Tray) |
| Supply Voltage (Core) | [DATA_NEEDED: core supply voltage] | — |
| Speed Grade | C4 | -3 |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Elements | — | 90,960 |
| LABs / CLBs | — | 4,548 |
| Total Memory Bits | — | 4,520,448 |
| Maximum User I/O | — | 650 |
| Core Voltage | — | 1.2 V |
| Configuration Method | — | SRAM-based, JTAG / Passive / Active serial |