EP2SGX90FF1508I3N vs EP2SGX90FF1508I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508I3N sa pamamagitan ng Intel at EP2SGX90FF1508I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel
EP2SGX90FF1508I3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2SGX90FF1508I3N | EP2SGX90FF1508I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | 90960 |
| Configurable Logic Blocks (CLBs) | 90960 | — |
| Embedded Memory (bits) | 4520448 | — |
| Memory Blocks | TriMatrix (M512/M4K/M-RAM) | — |
| Embedded Multipliers | 18x18-bit | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Maximum Internal Clock Frequency | 816.9 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial |
| Packhaging | 1508-ball FC-FBGA (flip-chip) | 1508-BBGA, FCBGA |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 1508 | — |
| Package Shape | Square | — |
| Configuration Method | EPC enhanced configuration device / JTAG | JTAG, Passive Serial |
| Multi-Gigabit Transceivers | Embedded (PCIe / RapidIO / GBE capable) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Lead-Free (compliant per datasheet) |
| Speed Grade | I3N (industrial, fast) | — |
| Logic Array Blocks (LABs) | — | 4548 |
| Total Embedded Memory | — | 4520448 bits |
| Maximum User I/O | — | 650 |
| Package Body Size | — | 40 mm x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |