EP3C10F256C8N vs EP3C5F256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C10F256C8N sa pamamagitan ng Altera at EP3C5F256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C10F256C8N | EP3C5F256C6N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | EP3C5 |
| Logic Elements | 10,320 | — |
| Logic Array Blocks (LABs) | 645 | 182 (per DigiKey listing) |
| Embedded Memory (Bits) | 423,936 | — |
| User I/Os | 182 | — |
| Operating Frequency (max) | 402 MHz | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Packhaging | 256-pin FineLine BGA (FBGA-256, 17 x 17 x 1.8 mm) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 C to 85 C (Commercial, 'C' grade) | 0 C to +85 C (commercial "C6" speed grade) |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Level ng MSL | MSL3 (per JEDEC J-STD-020, typical for FineLine BGA) | — |
| Configuration Method | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG | — |
| Equivalent Gate Count | ~0.5 M Gates (approximate) | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 5136 |
| Total Memory Bits | — | 423936 |
| Maximum User I/Os | — | 182 |
| Core Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.2 V |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |