EP3C55F484C7 vs EP3CLS150F484C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C7 sa pamamagitan ng Intel at EP3CLS150F484C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484C7 | EP3CLS150F484C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Device Family | Cyclone III | — |
| Logic Elements (LE) | 55,856 | 149,760 |
| Logic Array Blocks (LABs) | 3,495 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | — |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | 60 nm TSMC low-power CMOS |
| Core Voltage | 1.2 V | — |
| Packhaging | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Family | — | Cyclone III LS |
| Total Memory Bits | — | 6,138,560 |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Count | — | 210 |
| Configuration Logic Blocks (CLBs) | — | 150,848 |
| Maximum User I/O Pins | — | 210 |
| Supply Voltage Core (VCCINT) | — | 1.2 V |
| Supply Voltage Auxiliary (VCCAUX) | — | 2.5 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| AES Bitstream Encryption | — | AES-256 with 64-bit volatile key |