EP3C55F484C7N vs EP3C55F484C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C7N sa pamamagitan ng Intel at EP3C55F484C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484C7N | EP3C55F484C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Cyclone III | — |
| Logic Elements | 55,856 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Maximum User I/O | 327 | — |
| Number of LABs/CLBs | 3,491 | — |
| Embedded Multipliers (18x18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Packhaging | 484-FBGA (FineLine BGA) | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) |
| Speed Grade | 7 | — |
| Temperature na Operasyon | 0C to 85C (Commercial) | — |
| Process Technology | 60 nm TSMC low-power | 65 nm TSMC low-k CMOS |
| Configuration Modes | JTAG, AS, AP, PS | — |
| Encryption | AES-256 | — |
| Volte ng Pagbibigay | 1.2 V core (VCCINT) | — |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Device Family | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,495 |
| Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks of 9 Kbit each |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 327 |
| Internal Operating Frequency (max) | — | 472 MHz |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0 °C to +85 °C) - C7 speed grade |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Configuration Mode | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Configuration Memory Type | — | SRAM (volatile, requires external flash) |