EP3C55F780C7 vs EP3C55F780C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C7 sa pamamagitan ng Intel at EP3C55F780C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C7 | EP3C55F780C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | — |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Packhaging | 780-ball FBGA (F780) | 780-ball FBGA |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | 8 |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (234 M9K blocks) |
| Embedded Multipliers (18x18) | — | 156 |
| User I/O Pins | — | 377 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Configuration Memory | — | SRAM-based |