EP3C55F780C8 vs EP3C55F780C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C8 sa pamamagitan ng Intel at EP3C55F780C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C8 | EP3C55F780C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | — |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory | 2,396,160 bits (234 M9K blocks) | — |
| Embedded Multipliers (18x18) | 156 | — |
| User I/O Pins | 377 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | 65 nm low power |
| Core Voltage | 1.2 V | — |
| Packhaging | 780-ball FBGA | 780-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 8 | -6 (C6) |
| Configuration Memory | SRAM-based | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone III |
| Embedded Memory Bits | — | 2,396,160 |
| Number of Block RAM (M9K) | — | 260 |
| 18x18 Hardware Multipliers | — | 156 |
| User I/Os | — | 377 |
| Configuration Methods | — | JTAG, AS, AP, PS |
| Number of PLLs | — | 4 |
| Maximum User I/O Voltage Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |