EP3C5M164I7N vs EP3C5M164I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5M164I7N sa pamamagitan ng Intel at EP3C5M164I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5M164I7N | EP3C5M164I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Logic Elements (LE) | 5136 | — |
| Embedded Memory | 423936 bits (approx. 414 Kbit) | — |
| Embedded Multipliers | 23 x 18x18 | — |
| User I/O Pins | 106 | — |
| Packhaging | 164-TFBGA (Micro BGA, M164, 8x8 mm) | 164-MBGA (FineLine BGA), 8x8 mm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | 7 | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Process Technology | 60 nm TSMC low-k | 65 nm low-power |
| PLLs | 2 | 4 |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Ball Pitch | 0.5 mm | — |
| Configuration Modes | PS, FPP, AS | JTAG, AS, PS, FPP |
| External Memory Support | DDR, DDR2, SDR, QDRII+ SRAM | — |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Temperature ng Junction na Operasyon | -40C to +100C | — |
| Series | — | Cyclone III |
| Logic Elements | — | 5,136 |
| Total Memory Bits | — | 423,936 (approx. 50 Kbyte) |
| Embedded Memory Blocks | — | M9K (9 Kbit blocks) |
| Number of M9K Blocks | — | [DATA_NEEDED: M9K block count] |
| Embedded 18x18 Multipliers | — | Up to 23 |
| Maximum User I/O | — | 106 |
| Operating Temperature (Junction) | — | -40C to +100C (Industrial) |
| Supply Voltage - Core | — | 1.2 V |