EP3CLS100F484C8 vs EP3CLS100F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F484C8 sa pamamagitan ng Altera at EP3CLS100F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS100F484C8 | EP3CLS100F484C7N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III LS | — |
| Number of Logic Elements | 100448 | — |
| Total RAM Bits | 4451328 bits | — |
| Number of User I/O | 278 | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm | 65 nm low-power (TSMC) |
| Maximum Clock Frequency Rating | 402 MHz | — |
| Package Type | FBGA-484 | — |
| Bilang ng Pins | 484 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | 8 (from C8 ordering code) | C7 |
| Temperature Grade | Commercial (C) | — |
| Number of LABs/CLBs | [DATA_NEEDED: Number of LABs/CLBs] | — |
| Number of Embedded Multipliers | [DATA_NEEDED: Number of Embedded Multipliers] | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: Operating temperature range from datasheet] | — |
| Tindminan RoHS | unknown | Compliant (lead-free, N suffix) |
| Family | — | Cyclone III LS |
| Logic Elements | — | 100,448 |
| Embedded Memory (bits) | — | 4,451,328 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | 4 |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| Packhaging | — | 484-ball FineLine BGA (FBGA-484) |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Configuration Method | — | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Security Features | — | Bitstream encryption, JTAG tamper protection |
| Design Software | — | Quartus II / Intel Quartus Prime |