EP3CLS100U484C8 vs EP3CLS100F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100U484C8 sa pamamagitan ng Intel at EP3CLS100F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS100F484C7N - Cyclone III LS FPGA 100K LE | Intel | 484-FBGA
EP3CLS100F484C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS100U484C8 | EP3CLS100F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 100,448 | — |
| Number of Logic Blocks / CLBs | 100,448 | — |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 |
| Maximum User I/O | 278 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm CMOS | 65 nm low-power (TSMC) |
| Maximum Internal Frequency | 402 MHz | — |
| Embedded Multipliers (18 x 18) | 66 | — |
| PLLs | 4 | 4 |
| Packhaging | UFBGA-484 (U484, 19 x 19 mm, 0.8 mm pitch) | 484-ball FineLine BGA (FBGA-484) |
| Configuration Modes | PS, FPP, JTAG | — |
| Security Features | AES-256 bitstream encryption, JTAG protection, tamper detection | Bitstream encryption, JTAG tamper protection |
| Temperature na Operasyon | Commercial (0C to +85C), part suffix C8 | — |
| Speed Grade | C8 (commercial, 8) | C7 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (lead-free, N suffix) |
| Logic Elements | — | 100,448 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Configuration Method | — | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Design Software | — | Quartus II / Intel Quartus Prime |