EP3CLS200F484I8N vs EP3CLS200F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484I8N sa pamamagitan ng Intel at EP3CLS200F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F484I8N | EP3CLS200F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Device Type | FPGA | — |
| Logic Elements | 198,464 | — |
| Embedded Memory Bits | 8,211,456 | — |
| Maximum User I/O Pins | 230 (typical, package-dependent) | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Operating Frequency | 402 MHz | — |
| Temperature na Operasyon | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Speed Grade | 8 | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Number of PLLs | 4 | — |
| Number of Global Clock Networks | 20 | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Core Voltage | — | 1.2 V |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| PLLs | — | 4 |