EP3CLS70F484C7N vs EP3CLS70F484C7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F484C7N sa pamamagitan ng Intel at EP3CLS70F484C7 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3CLS70F484C7N EP3CLS70F484C7
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone® III LS —
Logic Elements (LE) 70,208 —
Logic Array Blocks (LABs) 4,388 —
Embedded Memory Bits 3,068,928 —
Maximum User I/Os 278 —
Maximum Operating Frequency 437.5 MHz —
Process Technology TSMC 65nm low-power (LP) —
Core Supply Voltage (VCCINT) 1.2 V —
Package Type 484-ball FineLine BGA (FBGA-484) —
Package Dimensions 19 x 19 mm, 1.0 mm ball pitch —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon [DATA_NEEDED: commercial/industrial grade] 0 C to +70 C (commercial, C7 grade)
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant (per Intel product page) Compliant
Configuration Method JTAG / Passive Serial / Active Serial —
Design Tool Intel Quartus II (Cyclone III support) —
Family — Cyclone III LS
Logic Elements — 70,208 LE
Adaptive Logic Modules (ALMs) — 27,808 ALM
Embedded Memory — 2.93 Mbit (M9K blocks)
18x18 Hardware Multipliers — 278
Maximum User I/O — 294
PLLs — 4
Global Clocks — 20
Core Voltage — 1.15 V to 1.25 V
Maximum Internal Frequency — 437.5 MHz
Process Node — 65 nm TSMC low-power
Packhaging — 484-pin FBGA (FineLine BGA)
Packaging — Tray
Configuration Modes — JTAG, AS, AP, PS

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