EP3CLS70F484I7 vs EP3CLS70F484C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F484I7 sa pamamagitan ng Intel at EP3CLS70F484C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS70F484I7 | EP3CLS70F484C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | Cyclone III LS |
| Series | Cyclone III | — |
| Logic Elements (LE) | 70208 | — |
| Logic Array Blocks (LABs/CLBs) | 4388 | — |
| Embedded Memory (Bits) | 3068928 (about 2.93 Mbit) | — |
| Embedded Multipliers (18x18) | 278 | — |
| Maximum User I/O | 294 | — |
| Number of PLLs | 4 | — |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Process Technology | 65 nm TSMC | 65 nm TSMC low-power |
| Maximum Operating Frequency | 437.5 MHz | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | Commercial 0C to +85C (C8 grade) |
| Style ng Pagpapasok | SMD/SMT | — |
| Packhaging | 484-FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (FineLine BGA), 23x23 mm |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Configuration Mode | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Device Logic Elements (LEs) | — | 70,208 |
| Logic Array Blocks (LABs) | — | 4,388 |
| Embedded Memory Bits | — | 3,068,928 bits (approx. 2,997 Kbit) |
| DSP Blocks (18x18 Multipliers) | — | 247 |
| Maximum User I/Os | — | 278 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Global Clock Networks | — | 20 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 8 (slowest commercial) |
| Configuration Modes | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| Bitstream Encryption | — | AES-256 (LS family feature) |