EP3CLS70U484C7 vs EP3C55U484C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70U484C7 sa pamamagitan ng Intel at EP3C55U484C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS70U484C7 | EP3C55U484C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | — |
| Embedded Memory (bits) | 3,068,928 | 2,396,160 |
| User I/O Count | 278 | — |
| Packhaging | 484-ball UFBGA (U484, 19x19 mm) | 484-ball UBGA (Ultra-FineLine BGA) |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Maximum Internal Frequency | 437.5 MHz | — |
| PLLs | 4 | — |
| Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Global Clock Networks | 20 | — |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| Temperature na Operasyon | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (Commercial) |
| Speed Grade | 7 | C7 (Commercial) |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Multipliers (18x18) | — | 156 |
| Maximum User I/O Pins | — | 327 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |