EP3SE110F1152C2N vs EP3SE110F1152C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C2N sa pamamagitan ng Altera at EP3SE110F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE110F1152C2N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Altera
EP3SE110F1152C2N ObsoleteIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C2N | EP3SE110F1152C4 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | [DATA_NEEDED: LAB count] |
| User I/Os | 744 | — |
| Total Embedded Memory | 8,936,448 bits | — |
| Total RAM Blocks | 744 (M9K + M144K) | — |
| DSP Blocks | 112 (18x18 multipliers) | [DATA_NEEDED: 18x18 multiplier count] |
| Transceivers | [DATA_NEEDED: number of transceivers / data rate] | — |
| Maximum Core Frequency | 600 MHz | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Packhaging | 1152-ball FC-FBGA (35x35 mm) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial) | — |
| Speed Grade | C2 | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Embedded Memory | — | 8,936,448 bits |
| Maximum User I/Os | — | 744 |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |