EP3SE110F1152C4N vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C4N sa pamamagitan ng Intel at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C4N | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix III Enhanced (E) | — |
| Logic Elements | 107,500 | — |
| Memory Bits | 8,936,448 | — |
| Embedded Multipliers (18x18) | 896 | — |
| Logic Array Blocks (LABs) | 4300 | 10,200 |
| User I/O Pins | 744 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 1152-ball FCBGA (Flip-Chip BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / AES-256 | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Design Software | Quartus II (v9.1 or later) | Quartus II (Stratix III support) |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| Lead-Free | — | Yes |