EP3SE110F780C2N vs EP3SE110F780I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C2N sa pamamagitan ng Altera at EP3SE110F780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPagsanggunian na paghahambing
| Parametro | EP3SE110F780C2N | EP3SE110F780I3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory | 8,936,448 bits | — |
| User I/Os | 488 | — |
| Operating Frequency (max) | 600 MHz | — |
| Core Voltage | 1.1 V | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | 65 nm | 65 nm CMOS |
| Speed Grade | C2 | 3 (Fast) |
| Packhaging | 780-ball FC-FBGA | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Package Code | BGA (square) | — |
| Terminal Form | Ball | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (other) | — |
| Tindminan RoHS | Compliant | Compliant |
| Programming Tool | Quartus II | — |
| Logic Elements | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/Os | — | 488 |
| Temperature na Operasyon | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| PLLs | — | Yes, with global and regional clock networks |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |