EP3SE110F780I2N vs EP3SE110F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I2N sa pamamagitan ng Intel at EP3SE110F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780I2N | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III Enhanced | Stratix III E |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| Embedded Memory (M9K + M144K) | 8,244 Kbits | — |
| Embedded Multipliers (18x18) | 528 | — |
| User I/O Pins | 488 | — |
| Transceiver Channels | 12 (up to 8.5 Gbps) | 8 (multi-gigabit) |
| PLLs | 8 | — |
| Hard Memory Controllers | 4 | — |
| Packhaging | 780-ball FBGA (29x29 mm) | 780-ball FCBGA (Flip-Chip BGA) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Speed Grade | 2 | — |
| Process Technology | 40 nm CMOS | 65 nm |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal] | — |
| LVDS Support | Up to 1.4 Gbps | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |