EP3SE110F780I2N vs EP3SE110F780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I2N sa pamamagitan ng Intel at EP3SE110F780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780I2N | EP3SE110F780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III Enhanced | Stratix III |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory (M9K + M144K) | 8,244 Kbits | — |
| Embedded Multipliers (18x18) | 528 | — |
| User I/O Pins | 488 | — |
| Transceiver Channels | 12 (up to 8.5 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | 4 | — |
| Packhaging | 780-ball FBGA (29x29 mm) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to 85C (Commercial) |
| Speed Grade | 2 | C4 |
| Process Technology | 40 nm CMOS | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal] | — |
| LVDS Support | Up to 1.4 Gbps | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-BBGA, FCBGA |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Uri ng Pagpapasok | — | Surface Mount |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |