EP3SE260F1152C2G vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2G sa pamamagitan ng Altera at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoletePagsanggunian na paghahambing
| Parametro | EP3SE260F1152C2G | EP3SE260F1152C2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix III E | — |
| Series | EP3SE260 | Stratix® III E |
| Logic Elements / Cells | 255000 | — |
| Total RAM Bits | 16672768 | — |
| Number of LABs / CLBs | 10200 | — |
| Number of I/O | 744 | — |
| Number of Terminals | 1152 | — |
| Packhaging | 1152-BBGA, FCBGA (FineLine BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | BGA (Ball Grid Array) | — |
| Package Shape | Square | — |
| Technology / Process Node | 65 nm | — |
| Core Voltage | 1.1 V | — |
| Speed Grade | C2 (commercial) | C2 (commercial) |
| Lead-Free (RoHS) | Yes (G suffix) | — |
| Operating Temperature Grade | Commercial (C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supply Packaging | Tray | — |
| Tindminan RoHS | Compliant (G suffix) | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Process Technology | — | 65 nm CMOS |
| Temperature na Operasyon | — | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |