EP3SE260F1152C3 vs EP3SE260F1152C2G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3 sa pamamagitan ng Intel at EP3SE260F1152C2G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Huling PagbiliAltera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoletePagsanggunian na paghahambing
| Parametro | EP3SE260F1152C3 | EP3SE260F1152C2G |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Series | Stratix III E | EP3SE260 |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 744 | — |
| Embedded 18x18 Multipliers | 384 | — |
| Packhaging | 1152-ball FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Core Voltage | 0.9 V to 1.1 V | 1.1 V |
| Process Technology | 40 nm | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| PLLs | 12 | — |
| Tindminan RoHS | Compliant | Compliant (G suffix) |
| Speed Grade | C3 | C2 (commercial) |
| Family | — | Stratix III E |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Operating Temperature Grade | — | Commercial (C) |
| Supply Packaging | — | Tray |