EP3SE260F1152C4L vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4L sa pamamagitan ng Intel at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4L ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1152C4L | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix III E | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Adaptive Logic Modules (ALMs) | 10,200 | — |
| Total Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/O Pins | 744 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 0.9 V | — |
| Packhaging | 1152-ball FC-FBGA | 1152-ball FC-FBGA (Flip Chip) |
| Temperature na Operasyon | 0C to +85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Maximum Frequency | 375 MHz | — |
| Transceivers | Integrated high-speed transceivers | — |
| Memory Interfaces | DDR2/DDR3 with hard controllers | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |