EP3SE260F1152I3 vs EP3SE260F1152C2G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3 sa pamamagitan ng Intel at EP3SE260F1152C2G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoletePagsanggunian na paghahambing
| Parametro | EP3SE260F1152I3 | EP3SE260F1152C2G |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix III E (EP3SE260) | EP3SE260 |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16672768 |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | 65 nm | — |
| Maximum Fabric Frequency | 500 MHz | — |
| Packhaging | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-BBGA, FCBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | C2 (commercial) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (G suffix) |
| Product Status | Obsolete (per Xecor comparator) | — |
| Family | — | Stratix III E |
| Logic Elements / Cells | — | 255000 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Operating Temperature Grade | — | Commercial (C) |
| Supply Packaging | — | Tray |