EP3SE260F1152I4N vs EP3SE260F1152I4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I4N sa pamamagitan ng Intel at EP3SE260F1152I4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Huling PagbiliIntel
EP3SE260F1152I4LN - Stratix III E FPGA 255K LE FCBGA-1152 | Intel
EP3SE260F1152I4LN ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SE260F1152I4N | EP3SE260F1152I4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Series | Stratix III E | Stratix III |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/O | 744 | — |
| DSP Blocks (18x18 multipliers) | 896 | — |
| Transceivers | 48 (up to 8.5 Gbps) | — |
| Core Voltage | 0.86 V | 0.9 V (supports 1.05-1.15 V variant) |
| Process Technology | TSMC 40 nm | — |
| Packhaging | 1152-ball FCBGA (35 mm x 35 mm) | FCBGA-1152 (1517-ball) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40 C to +100 C (Industrial) |
| Speed Grade | 4 | — |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Stratix III E |
| Process Node | — | 65 nm CMOS |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Embedded Memory Bits | — | 16,672,640 |
| User I/Os | — | 744 |
| Package Dimensions | — | 35 x 35 mm |
| Operating Frequency | — | Up to 717 MHz |
| Supply Voltage Range | — | 0.9 V core, 1.05 V-1.15 V supported |
| Design Tool | — | Quartus II |