EP3SE260F1152I4N vs EP3SL200F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I4N sa pamamagitan ng Intel at EP3SL200F1152I4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Huling PagbiliAltera
EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial
EP3SL200F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1152I4N | EP3SL200F1152I4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix III E | Stratix III L |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 8,000 |
| Maximum User I/O | 744 | — |
| DSP Blocks (18x18 multipliers) | 896 | — |
| Transceivers | 48 (up to 8.5 Gbps) | Multi-gigabit SERDES MGTs |
| Core Voltage | 0.86 V | — |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Packhaging | 1152-ball FCBGA (35 mm x 35 mm) | 1152-ball FC-FBGA (F1152) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Speed Grade | 4 | I4 (industrial, slowest) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Stratix III |
| Adaptive Logic Modules (ALMs) | — | 80,160 |
| User I/Os | — | 744 |
| Total Embedded Memory Bits | — | 10,901,504 (approx. 10.9 Mbit) |
| Embedded Multipliers (18x18) | — | Yes (DSP blocks) |
| Core Voltage (Vccint) | — | 1.1 V |
| Configuration | — | AES-128 bitstream encryption supported |