EP3SE260F1517C2N vs EP3SE260F1517I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2N sa pamamagitan ng Intel at EP3SE260F1517I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2N | EP3SE260F1517I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total Memory Bits | 16,672,768 | — |
| Maximum User I/Os | 976 | 976 |
| Core Voltage | 1.1 V | 1.0 V typical |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Core Frequency | 600 MHz | 717 MHz |
| Packhaging | 1517-ball FC-BGA | 1517-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +85C) | Industrial |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG, Active Serial | — |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Speed Grade | C2 | — |
| Embedded Memory (bits) | — | 16,672,768 |
| Junction Temperature Range | — | -40C to +125C |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Configuration | — | SRAM-based, volatile (requires external configuration device) |